september 2011 doc id 9173 rev 6 1/9 9 stps2l60 power schottky rectifier features negligible switching losses low forward voltage drop surface mount miniature package avalanche capability specified ecopack2 ? compliant component (smb flat) description axial and surface mount power schottky rectifiers suited to switched mode power supplies and high frequency dc to dc converters. packaged in sma, do-41 and smb flat this device is especially intended for use in low voltage, high frequency inverters and small battery chargers. table 1. device summary symbol value i f(av) 2 a v rrm 60 v t j (max) 150 c v f (max) 0.55 v k a k a sma (jedec do-214ac) stps2l60a smb flat (jedec do221-aa) stps2l60uf k a do-41 stps2l60 www.st.com
characteristics stps2l60 2/9 doc id 9173 rev 6 1 characteristics to evaluate the conduction losses use the following equation: p = 0.43 x i f(av) + 0.06 i f 2 (rms) table 2. absolute ratings (limiting values) symbol parameter value unit v rrm repetitive peak reverse voltage 60 v i f(rms) forward rms voltage 10 a i f(av) average forward current smb flat t l = 130 c = 0.5 2a sma t l = 115 c = 0.5 do-41 t l = 110 c = 0.5 i fsm surge non repetitive forward current t p =10 ms sinusoidal 75 a p arm repetitive peak avalanche power t p = 1 s t j = 25 c 1600 w t stg storage temperature range -65 to + 150 c t j maximum operating junction temperature (1) 1. condition to avoid thermal r unaway for a diode on its own heatsink 150 c dv/dt critical rate of rise of reverse voltage 10000 v/s table 3. thermal resistance symbol test conditions value unit r th(j-l) junction-lead smb flat 15 c/w sma 25 lead length = 10 mm do-41 30 table 4. static electrical characteristics symbol parameter test conditions min. typ. max. unit i r (1) 1. pulse test: t p = 380 s, < 2% reverse leakage current t j = 25 c v r = v rrm 100 a t j = 100 c 2 10 ma v f (1) forward voltage drop t j = 25 c i f = 2 a 0.60 v t j = 125 c 0.51 0.55 t j = 25 c i f = 4 a 0.77 t j = 125 c 0.62 0.67 dptot dtj < 1 rth(j-a)
stps2l60 characteristics doc id 9173 rev 6 3/9 figure 1. average forward power dissipation versus average forward current figure 2. average forward current versus ambient temperature ( = 0.5) do-41, sma p (w) f(av) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 i (a) f(av) = 1 = 0.5 = 0.2 = 0.1 = 0.05 t =tp/t tp i (a) f(av) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 0 25 50 75 100 125 150 t (c) amb t =tp/t tp r =100c/w th(j-a) r=r th(j-a) th(j-i) do-41 sma figure 3. average forward current versus ambient temperature ( = 0.5) smb flat figure 4. normalized avalanche power derating versus pulse duration 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 0 25 50 75 100 125 150 r th(j-a) =r th(j-l) smb flat smbflat smb flat r th(j-a) =40 c/w s cu =2.5 cm2 smbflat r th(j-a) =40 c/w s cu =2.5 cm2 i (a) f(av) t (c) amb t =tp/t tp 0.001 0.01 0.1 0.01 1 0.1 10 100 1000 1 t (s) p p(t) p (1s) arm p arm figure 5. normalized avalanche power derating versus junction temperature figure 6. non repetitive surge peak forward current versus overload duration (maximum values) (sma) 0 0.2 0.4 0.6 0.8 1 1.2 25 50 75 100 125 150 t (c) j p(t j ) p (25c) arm arm i (a) m 0 1 2 3 4 5 6 7 8 9 10 1.e-03 1.e-02 1.e-01 1.e+00 i m t =0.5 t(s) t =25c a t =125c a t =75c a
characteristics stps2l60 4/9 doc id 9173 rev 6 figure 7. non repetitive surge peak forward current versus overload duration (maximum values) (do-41) figure 8. non repetitive surge peak forward current versus overload duration (maximum values) (smb flat) i (a) m 0 1 2 3 4 5 6 7 8 9 10 1.e-03 1.e-02 1.e-01 1.e+00 i m t =0.5 t(s) t =25c a t =125c a t =75c a 0 5 10 15 20 25 30 1.e-03 1.e-02 1.e-01 1.e+00 t l =25c t l =75c t l =125c smbflat i (a) m t(s) i m t =0.5 figure 9. relative variation of thermal impedance junction to ambient versus pulse duration (sma) figure 10. relative variation of thermal impedance junction to ambient versus pulse duration (do-41) z/r th(j-a) th(j-a) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-02 1.e-01 1.e+00 1.e+01 1.e+02 t (s) p single pulse epoxy pr i nted ci r cui t boar d fr4, copper thi ckn ess: 35 m z/r th(j-a) th(j-a) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-01 1.e+00 1.e+01 1.e+02 1.e+03 t (s) p single pulse figure 11. relative variation of thermal impedance junction to lead versus pulse duration (smb flat) figure 12. reverse leakage current versus reverse voltage applied (typical values) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-04 1.e-03 1.e-02 1.e-01 1.e+00 single pulse z/r th(j-l) th(j-l) t (s) p epoxy printed circuit board fr4, copper thickness: 35 m i (a) r 1.e+00 1.e+01 1.e+02 1.e+03 1.e+04 1.e+05 0 102030405060 v (v) r t =125c j t =150c j t =100c j t =75c j t =50c j t =25c j
stps2l60 characteristics doc id 9173 rev 6 5/9 figure 13. junction capacitance versus reverse voltage applied (typical values) figure 14. forward voltage drop versus forward current (maximum values, low level) c(pf) 10 100 1000 1 10 100 f=1mhz v =30mv t =25c osc j v (v) r i (a) fm 0 1 2 3 4 5 6 7 8 9 10 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 v (v) fm t =25c (maximum values) j t =125c (maximum values) j t =125c (typical values) j figure 15. thermal resistance junction to ambient versus copper surface under each lead (sma and smb flat) figure 16. thermal resistance versus lead length (do-41) r (c/w) th(j-a) 0 10 20 30 40 50 60 70 80 90 100 110 120 130 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 s(cu)(cm2) sma smbflat epoxy printed circuit board fr4, copper thickness: 35 m r (c/w) th r th(j-i) 0 20 40 60 80 100 120 5 10152025 r th(j-a) l (mm) leads
package information stps2l60 6/9 doc id 9173 rev 6 2 package information epoxy meets ul94, v0 lead-free package in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 17. smb flat footprint dimensions the footprint in figure 17 has been optimized for the smb flat package. the footprint of the smb package can be used instead. table 5. smb flat dimensions ref. dimensions millimeters inches min. typ. max. min. typ. max. a 0.90 1.10 0.035 0.043 b 1.95 2.20 0.077 0.087 c 0.15 0.40 0.006 0.016 d 3.30 3.95 0.130 0.156 e 5.10 5.60 0.200 0.220 e1 4.05 4.60 0.189 0.181 l 0.75 1.50 0.029 0.059 l1 0.40 0.016 l2 0.60 0.024 d a l 2x l l1 2x l2 2x e e1 b c 1.20 (0.047) 1.20 (0.047) 3.44 (0.136) 5.84 (0.230) 2.07 (0.082) millimeters (inches)
stps2l60 package information doc id 9173 rev 6 7/9 figure 18. footprint, dimensions in mm (inches) table 6. sma dimensions ref. dimensions millimeters inches min. max. min. max. a1 1.90 2.45 0.075 0.094 a2 0.05 0.20 0.002 0.008 b 1.25 1.65 0.049 0.065 c 0.15 0.40 0.006 0.016 d 2.25 2.90 0.089 0.114 e 4.80 5.35 0.189 0.211 e1 3.95 4.60 0.156 0.181 l 0.75 1.50 0.030 0.059 table 7. do-41 package dimensions ref dimensions millimeters inches min. max. min. max. a 4.07 5.20 0.160 0.205 b 2.04 2.71 0.080 0.107 c 25.4 1 d 0.71 0.86 0.028 0.034 e c l e1 d a1 a2 b 2.63 (0.103) 5.43 (0.214) 1.4 1.64 (0.064) 1.4 (0.055) (0.055) ca b o / o / d o / d c
ordering information stps2l60 8/9 doc id 9173 rev 6 3 ordering information 4 revision history table 8. ordering information order code marking package we ight base qty delivery mode stps2l60a s26 sma 0.068 g 5000 tape and reel stps2l60 stps2l60 do-41 0.34 g 2000 ammopack stps2l60rl stps2l60 do-41 0.34 g 5000 tape and reel stps2l60uf fg26 smb flat 0.050 g 5000 tape and reel table 9. document revision history date revision changes jul-2003 2a last update. aug-2004 3 sma package dimensions update. reference a1 max changed from 2.70 mm (0.106 inch) to 2.03 mm (0.080 inch). 18-sep-2008 4 reformatted to current standards. added smb flat package. 30-sep-2009 5 updated table 7 package dimensions. 23-sep-2011 6 updated sma package information.
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